Young Taiwanese company ENCTEC presented a new approach to the organization of silent computer cooling. Instead of using tower radiators or massive tower coolers that heat the internal space of the system unit, it proposes to throw heat directly outside the tower.
To do this, the Taiwanese have placed a CPU socket on the back of the motherboard, which allows the passive CPU cooler to be installed outside the PC tower, improving natural convection. In addition, thanks to this design, the exhaust air will not additionally heat the rest of the system.
Of course, for motherboards with CPU socket on the back side you will need a special case. In the case of the ENCTEC prototype it is a quite familiar Mid-Tower with a window on the side wall.
The company’s specialists also experimented with the open stand of Thermaltake Core P5, placing an air CPU cooler and liquid cooling system on its back side.
The motherboard used for the tests is based on an Intel B250 chipset and is compatible with Intel Core 6/7th generation chips. For the final product will use a more modern platform from Intel or AMD.
However, ENCTEC does not yet name the approximate time of the motherboards with CPU socket on the back side.