TSMC, the largest contract manufacturer of semiconductor products, began construction of the production complex, where it is planned to master the 2-nanometer process. The complex includes a research and development center and production facility. The new facilities will be located near the TSMC headquarters in Xinzhou Science Park, Taiwan.
According to preliminary data, the 2-nanometer process will use Gate-All-Around (GAA) technology. At the same time, the manufacturer began planning to develop a 1-nanometer process.
Along with technology for the production of crystals, TSMC is improving the technology of their packaging. It plans to accelerate the introduction of advanced packaging technologies such as SoIC, InFO, CoWoS and WoW. All are classified by TSMC as 3D Fabric, although some are 2.5D. These technologies will be introduced into mass production on ZhuNan and NanKe lines in the second half of 2021.