A well-known insider Roland Quandt, who almost never makes mistakes in his leaks or forecasts, told about three new single crystal platforms Qualcomm. As it turned out, Snapdragon 875 will have an improved version under the name of Snapdragon 875 Plus, but most of all it can surprise Snapdragon 775G.
And it is pleasant to surprise. First, it will be a little thinner technical process: 6 nm instead of 7 nm. Secondly, it will significantly improve the performance.
As the insider writes, Snapdragon 775G will be much closer to Snapdragon 875 than Snapdragon 765G to Snapdragon 865. In fact, Snapdragon 775G is already being tested in the test platform. It has 12 GB of LPDDR5 RAM, 256 GB of UFS 3.1 flash memory and a 120 Hz frame rate screen. It is expected that the performance of the Snapdragon 775G CPU will increase by 40% and the performance of the graphics processor – by 50%! And of course, Snapdragon 775G should have a built-in 5G modem, which Snapdragon 875, most likely, will not: in top platforms it will be offered as an add-on module.
By the way, about top SoC. They are coded Lahaina (Snapdragon 875) and Lahaina+ (Snapdragon 875 Plus). The code designation for Snapdragon 775G is Cedros.
Snapdragon 875 is ascribed to the high-performance Cotex-X1 core, the same must be true for Snapdragon 875 Plus. You can only guess about the composition of Snapdragon 775G yet, but at best this platform will get one or more high-performance Cortex-A78 kernels.