Intel announced that the U.S. Department of Defense has approved its participation in the second phase of the State-of-the-Art Heterogeneous Integration Prototype (SHIP) program.
The program enables the U.S. government to gain access to Intel’s state-of-the-art semiconductor manufacturing facilities in Arizona and Oregon. In particular, we are talking about packaging technologies.
At the second stage of the program, prototypes of multi-crystal packages will be developed and promotion of interface, protocol and security standards for heterogeneous systems will be accelerated. SHIP prototypes will combine specialized government chips with advanced commercially available Intel silicon products, including programmable valve matrices, specialized integrated circuits and processors.
This combination of technologies provides U.S. government industry partners with new opportunities to develop and upgrade critical government systems while leveraging Intel’s manufacturing capabilities in the United States.
That is, Intel will create customized solutions for the U.S. Department of Defense that combine both Intel’s own multi-core and government-centric designs in one package. It is unlikely that we will ever know the details of such products, but they will clearly be very unusual.